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Let us help you find solutions to manage heat generating electronics. We can offer a wide array of die cut material options most suited for your specific thermal management requirements.

Thermal Management

IATF 16949 Certified Manufacturer

Gap Filler, Thermal Interface Pad

Converters of Advanced Thermal Management Solutions

PDCI offers die cut converted products and services for Thermal Management.

Thermal Gap Filling Pad

Appliances

Lighting

Thermal Interface Material

Mobile Devices

Hard Drives

Battery Thermal Management

PCB Thermal Management

IC to Heat Sink Bonding

Material Selection

Low Modulus Polymer

Gap Filling Pad

High Temp Stability

Good Flexibility

Flammability Rated

Conductive Fillers

Shock Absorbing

Conformable to Irregular Surfaces

Low Modulus Polymer

Rubber Coated Fiber

Fiber Reinforced Gap Filler

High Temp Stability

Durable

Silicone Free Options

Flammability Rated

Rubber Coated Fiber

Metallic Foil

Conductive Metallics: Tin, Gold, Silver, Nickel, Copper, Aluminum

Electrical Conductivity

Thermal Conductivity

PSA Backed Options (Tapes)

Metallic Foil

Silicone Elastomers

Conductive Fillers

Grease Free

High Temp Stability

Good Flexibility

Good Chemical Resistance

Flammability Rated

Silicone Elastomers

Polyimide Film

Adhesive Bonding Options

Excellent Thermal Properties

Excellent Chemical Resistance

Conductive & Non-Conductive Options
 

Polyimide Film

For more information about PDCI's additional material offerings for Thermal Management, please Contact Us.