+1 510.732.8103
+1 510.732.8103
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Let us help you find solutions to manage heat generating electronics. We can offer a wide array of die cut material options most suited for your specific thermal management requirements.
Thermal Management
IATF 16949 Certified Manufacturer
Gap Filler, Thermal Interface Pad
Converters of Advanced Thermal Management Solutions
PDCI offers die cut converted products and services for Thermal Management.
Thermal Gap Filling Pad
Appliances
Lighting
Thermal Interface Material
Mobile Devices
Hard Drives
Battery Thermal Management
PCB Thermal Management
IC to Heat Sink Bonding
Material Selection
Low Modulus Polymer
Gap Filling Pad
High Temp Stability
Good Flexibility
Flammability Rated
Conductive Fillers
Shock Absorbing
Conformable to Irregular Surfaces
Low Modulus Polymer
Rubber Coated Fiber
Fiber Reinforced Gap Filler
High Temp Stability
Durable
Silicone Free Options
Flammability Rated
Rubber Coated Fiber
Metallic Foil
Conductive Metallics: Tin, Gold, Silver, Nickel, Copper, Aluminum
Electrical Conductivity
Thermal Conductivity
PSA Backed Options (Tapes)
Metallic Foil
Silicone Elastomers
Conductive Fillers
Grease Free
High Temp Stability
Good Flexibility
Good Chemical Resistance
Flammability Rated
Silicone Elastomers
Polyimide Film
Adhesive Bonding Options
Excellent Thermal Properties
Excellent Chemical Resistance
Conductive & Non-Conductive Options
Polyimide Film
For more information about PDCI's additional material offerings for Thermal Management, please Contact Us.